Copper Plating:
Our copper electroplating process provides a semi-bright deposit and is recommended for use as a strike on difficult-to-plate metals. The process provides improved deposit adhesion to the substrate as well as surface activation prior to subsequent electroplating.
Features And Benfits:
- Easy-to-use single additive strike bath.
- Semi-bright deposit.
- Improved adhesion on hard to plate substrates.
- Provides activation of base metal.