From increased durability and corrosion resistance to a stunning visual appeal, our Electrolytic Nickel Sulfamate Plating, Gold Plating, and other cutting-edge techniques will help you achieve your desired results.
Our Gold Plating coatings conform to: MIL-DTL-45204, ASTM B488, Type I&II, Code A, up to 99.7% pure
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The Nickel S process is designed to produce a low stress, semi-bright, ductile nickel deposit for electronics applications in rack/barrel and SBE plating equipment.
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Hot Air Solder Leveling (HASL) is one of the most common types of PCB surface finishes used in the industry today. HASL finishes are composed of solder...
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Our Electroless Nickel meets AMS-C-26074, AMS 2404, AMS 2405, and ASTM B733. specifications...
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Immersion White Tin specially engineered “Immersion White Tin” process that can be used as a direct replacement for the hot air solder leveling process...
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Is an acetic acid based solution containing a substituted imidazole that is designed to produce a thin organic coating on copper...
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Our Silver is bright to mirror-bright ductile deposits with excellent wear resistance. the deposits meet the requirements of QQ-S-365B...
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Our bath is a blend of chemicals formulated for the cleaning and passivation of stainless-steel products. It is specifically designed to provide low cost...
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Our copper electroplating process provides a semi-bright deposit and is recommended for use as a strike on difficult-to-plate metals...
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The IRIDITE NCP, Non-Chrome Passivate has been developed in response to the ELV, RoHS and WEEE directives. The IRIDITE NCP does not contain Lead...
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Iridite 14 is a chemical process, which produces a clear to yellow corrosion-resistant film on aluminum and its alloys...
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Our bath is a blend of chemicals formulated for the cleaning and passivation of stainless-steel products. It is specifically designed to provide low cost...
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