Organic solderability protectant (OSP):
ORGANIC SOLDERABILITY PROTECTANT is an acetic acid based solution containing a substituted imidazole that is designed to produce a thin organic coating on copper while leaving gold plated connectors essentially coating-free. The coating preserves the solderability of the copper surface, it does easily soldered without the need for a separate step to remove the coating. It’s organic solderability protectant (OSP) process provides a thin, uniform, non-tacky film capable of maintaining the solderability of the copper surface through multiple soldering thermal cycles. The coating is formed through a chemical reaction with the copper surface and, when properly applied, will not affect non-metallic surfaces or contribute to ionic contamination. The process leaves gold plated connectors with little or no coating to eliminate the tarnished appearance associated with other OSPs and to allow trouble-free electrical test and functional connections