Immersion White Tin Plating:

Immersion White Tin specially engineered “Immersion White Tin” process that can be used as a direct replacement for the hot air solder leveling process. It will cover active copper surfaces with a very dense white tin that retains its solderability in excess of one year. The key to the process is the type and structure of the deposit. It is a fine crystalline structure that is non-porous.