Electrolytic Nickel Sulfamate Plating:
The Nickel S process is designed to produce a low stress, semi-bright, ductile nickel deposit for electronics applications in rack/barrel and SBE plating equipment. The bath can be used with soluble or insoluble anodes. This process meets the requirements of Fed. Spec. QQ-N-290A, Class 1 and 2 (AMS 2403).
Features And Benfits:
- Soft to hard deposits with good ductility.
- Ductile deposits with controllable or tensile stress.
- Ability to alter physical properties of the deposit for various uses.
- Good corrosion resistance.
- Good tolerance to impurities.
- Ease of solution purification. Continuous filtration through activated carbon and continuous electrolytic purification are possible.
- Stability over long periods of operation. 8. Controllable electrical resistivity of deposit